Solder Bump Inspection

The image shows a solder bump, measured with a Xyris 4000 WL over an area of 0.2 x 0.2 mm.. The colour corresponds to the height of the surface.

The cross-section through the aligned data set reveals a slight unevenness of the top surface of the bump.

When looking at a complete row of solder bumps, the measurement clearly shows that the bump height varies across the sample. The difference between highest and lowest bump is 8.5 micrometers.